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grandia1983
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(每日一文)Next Generation Heat Sinks for High-power Diode Laser Bars
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2008-7-22
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2008-7-25
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2008-7-29
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(每日一文)Acoustic Noise Cancellation by...
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(每日一文)DELPHI Style Compact Modeling of Stacked Die Packages
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2008-7-31
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(每日一文)Development of a Micro-diaphragm Pump ...
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(每日一文)High-Level Packaging Options for Outdoor Remote Unit
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2008-9-5
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grandia1983
2008-9-22
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(每日一文)Experimental Study on a Hybrid LiquidAir Cooling System
grandia1983
2008-9-10
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(每日一文)Fundamentals of a Floating Loop Concept...
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2008-9-11
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2008-9-17
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(每日一文)ASTM D 5470 TIM material testing
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2008-9-18
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2008-9-19
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(每日一文)Hot spot cooling using embedded thermoelectric coolers
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2008-9-25
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(每日一文)Microchip cooling module based on...
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(每日一文)Micro-scale liquid cooling system for...
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2008-10-10
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(每日一文)Operating controls and dynamics for...
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(每日一文)Low-noise cooling system for pc...
grandia1983
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(每日一文)Measurement and simulation of stacked die thermal resistances
grandia1983
2008-9-27
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179
2008-11-20 22:54
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cyril
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