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grandia1983 发表于 2008-7-29 09:00

（每日一文）Heat Transfer in a Three Dimensional Stacked CSP Module

Heat Transfer in a Three Dimensional Stacked Chip Scale Package (CSP) Module

摘自“SEMI-THERM” 2007

老五 发表于 2008-12-3 17:30

感谢分享~~~~~~~~~~~~~

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