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grandia1983 发表于 2008-7-7 09:27

（每日一文）Process Development for Heat Sink Attachment...

Process Development for Heat Sink Attachment Using Thermally Conductive Liquid Adhesives

摘自“SEMI-THERM” 2007

老五 发表于 2008-12-3 17:38

感谢分享~~~~~~~~~~~~~

cadmen 发表于 2008-12-9 07:44

谢谢楼主分享!!!!

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