Icepak最新版功能，MRF
Icepak剛推出最新版的4.4.8，客戶可直接至原廠官網下載這時候的新版本主要是Bug的修正，不用太期待什麼
不過4.4.8新出了一個MACRO：MRF，Moving Reference Frame
可以模擬風扇完整幾何的流場，而不需輸入PQ curve
當然，使用者要視個別實際應用情況來判斷何者對自己的分析最好
[align=center][b][size=+3]Release Notes for Icepak 4.4.8 [/b][/align][size=+2][b][color=#000000]1 Introduction[/color][/b][size=+0] [b]Icepak[/b] 4.4.8 is a maintenance release of [b]Icepak[/b] 4.4.6 that has new features and defect fixes. New features are listed in Section 2 of this document. Known limitations are listed in Section 3. A list of defects fixed in this release is accessible from our online [url=http://www.icepak.com/prod/icepak/support/login/index.htm][color=#0000ff]Icepak User Services Center[/color][/url]. ( [font=NSimSun][url=http://www.icepak.com/prod/icepak/support/login/index.htm]www.icepak.com/prod/icepak/support/login/index.htm[/url][/font]). [size=+2][b][color=#000000]2 New and Modified Features in [b]Icepak[/b] 4.4.8[/color] [/b][size=+0] [list][*]ECAD import/export[list][*]Import of Integrated Circuit (IC) power map profiles exported from the chip-level thermal analysis tools, Gradient Firebolt and Cadence Encounter is available. See Section [url=http://www.fluentusers.com/icepak/doc/html/addendum/node7.htm][color=#0000ff]2.4.1 [/color][/url]of the Addendum Guide.[*]Export of package die thermal resistance data to Gradient Firebolt and Cadence Encounter is available. This capability along with the power map import capability will enable integrated chip-to-system level thermal analysis for IC designs. See Section [url=http://www.fluentusers.com/icepak/doc/html/addendum/node8.htm][color=#0000ff]2.5.1[/color][/url] of the Addendum Guide.[*]IDF import: Power filtering of components modeled using text file import is available. See Section [url=http://www.fluentusers.com/icepak/doc/html/addendum/node6.htm][color=#0000ff]2.3.1[/color][/url] of the Addendum Guide.[/list]
[*]Modeling and meshing[list][*]Advanced modeling of joule heating in conductors by solving a scalar equation for the electric potential is available. This capability will allow for accurate prediction of the electric current or voltage in every section of the conductor. Hence the power specification due to joule heating can be accurately determined. See Chapter [url=http://www.fluentusers.com/icepak/doc/html/addendum/node5.htm][color=#0000ff]2.2.1[/color][/url] of the Addendum Guide.[*]The Hex-Dominant Mesher (HDM) has been updated to handle complex CAD and non-CAD shapes.[*]Enhanced compound functions are available for parametric trials and optimization.[*]Enhanced options for monitor points are available.[*]Advanced fan modeling using the Moving Reference Frame (MRF) approach is available using a new macro.[*]Patching of initial temperatures of specific objects during transient simulations is available using a new macro.[*]The materials library has been updated with new vendor-provided data for Heat Spreaders and Laminates from GrafTech.[/list]
[*]Postprocessing and reporting[list][*]Postprocessing module has been enhanced resulting in faster and improved postprocessing.[/list][/list]
[size=+2][b][color=#000000]3 Known Limitations of [b]Icepak[/b] 4.4[/color] [/b][size=+0] [list][*]MCM/BRD import is available only on the WINDOWS and LINUX platforms.[*]Gerber import is available only on the Windows platform.[*]STEP export may not work on some objects, especially cylindrical objects.[*]STEP export is not supported on the IBM and HP-Alpha UNIX (Tru64 UNIX) platforms.[*]Non-conformal assemblies cannot intersect each other.[*]Non-conformal assemblies cannot touch objects (except the cabinet and hollow objects).[*]Thin plates cannot intersect or touch non-conformal assemblies.[*]CAD shaped objects cannot intersect or touch non-conformal assemblies.[*]The biaxial conductivity option for objects other than thin plates is not allowed.[*]Fast trials cannot be used when the properties of the default fluid are parameterized.[*]Batch queuing capability cannot be used to run trials/jobs across platforms.[/list] 感谢分享 感谢分享 thanks!!
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